Packaging structure of microminiature device and PCB

The utility model relates to the technical field of electronic components, and discloses a packaging structure of a microminiature device and a printed circuit board (PCB), the packaging structure of the microminiature device comprises a chip, a metal sheet and a light-transmitting film serving as a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SHI HONGLI, WEI SHENGCONG, LUO DEWEI, PI BAOQING
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The utility model relates to the technical field of electronic components, and discloses a packaging structure of a microminiature device and a printed circuit board (PCB), the packaging structure of the microminiature device comprises a chip, a metal sheet and a light-transmitting film serving as a peripheral enveloping piece, two ends of the lower surface of the chip are respectively provided with an electrode area, the area of the metal sheet is larger than the area of the electrode area, and the metal sheet and the light-transmitting film are arranged on the periphery enveloping piece. The two electrode areas of the chip are respectively provided with one metal sheet, the upper surface of each metal sheet is attached to the corresponding electrode area, and the lower surface of each metal sheet is used for being connected with an external carrier. According to the packaging structure provided by the embodiment of the utility model, the connection area of the chip and the external carrier is increased by a