Integrated circuit
The embodiment of the utility model relates to an integrated circuit. The utility model provides an integrated circuit. The integrated circuit comprises a semiconductor substrate; and a first semiconductor component including: a buried semiconductor region disposed in the semiconductor substrate and...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The embodiment of the utility model relates to an integrated circuit. The utility model provides an integrated circuit. The integrated circuit comprises a semiconductor substrate; and a first semiconductor component including: a buried semiconductor region disposed in the semiconductor substrate and having a first conductivity type; a first gate region and a second gate region disposed at a distance from each other and each extending in depth into the semiconductor substrate from the front surface of the semiconductor substrate, respectively, to the buried semiconductor region; a third gate region extending in depth into the semiconductor substrate from the front surface of the semiconductor substrate and configured to be electrically connected to the buried semiconductor region; and an active region of the semiconductor substrate defined by the first gate region, the second gate region, and the buried semiconductor region, the active region having a second conductivity type opposite the first conductivity ty |
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