Wafer suspension stage device

Wafer suspension stage device

A wafer suspension stage device comprises a stage body, a cavity is formed in the stage body, a plurality of dense air holes are formed in the top surface of the cavity, and the air holes penetrate through the top surface of the cavity and are exposed out of the upper surface of the stage body; the...

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1. Verfasser: ZHENG KUNXIAN
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Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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description A wafer suspension stage device comprises a stage body, a cavity is formed in the stage body, a plurality of dense air holes are formed in the top surface of the cavity, and the air holes penetrate through the top surface of the cavity and are exposed out of the upper surface of the stage body; the upper part of the carrying table body is used for carrying a wafer, and the wafer is a bare wafer which is not etched or a wafer which is etched and formed in a crystal grain form; the wafer is a high-transparency wafer, such as a third-generation semiconductor wafer or a transparent wafer; an air inlet is formed in one side of the carrying platform body and is communicated with the cavity; the air inlet mechanism comprises an air inlet pipeline which is connected with the air inlet; the air compression mechanism is connected with the air inlet pipeline and is used for compressing air and inputting the compressed air into the air inlet pipeline; when gas is input into the cavity, the gas overflows from the pluralit
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN217158151UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN217158151UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN217158151UU3</originalsourceid><addsrcrecordid>eNrjZJANT0xLLVIoLi0uSM0rzszPUyguSUxPVUhJLctMTuVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkaG5oamFoamhqGhxkQpAgAlBiUG</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Wafer suspension stage device</title><source>esp@cenet</source><creator>ZHENG KUNXIAN</creator><creatorcontrib>ZHENG KUNXIAN</creatorcontrib><description>A wafer suspension stage device comprises a stage body, a cavity is formed in the stage body, a plurality of dense air holes are formed in the top surface of the cavity, and the air holes penetrate through the top surface of the cavity and are exposed out of the upper surface of the stage body; the upper part of the carrying table body is used for carrying a wafer, and the wafer is a bare wafer which is not etched or a wafer which is etched and formed in a crystal grain form; the wafer is a high-transparency wafer, such as a third-generation semiconductor wafer or a transparent wafer; an air inlet is formed in one side of the carrying platform body and is communicated with the cavity; the air inlet mechanism comprises an air inlet pipeline which is connected with the air inlet; the air compression mechanism is connected with the air inlet pipeline and is used for compressing air and inputting the compressed air into the air inlet pipeline; when gas is input into the cavity, the gas overflows from the pluralit</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220809&amp;DB=EPODOC&amp;CC=CN&amp;NR=217158151U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220809&amp;DB=EPODOC&amp;CC=CN&amp;NR=217158151U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHENG KUNXIAN</creatorcontrib><title>Wafer suspension stage device</title><description>A wafer suspension stage device comprises a stage body, a cavity is formed in the stage body, a plurality of dense air holes are formed in the top surface of the cavity, and the air holes penetrate through the top surface of the cavity and are exposed out of the upper surface of the stage body; the upper part of the carrying table body is used for carrying a wafer, and the wafer is a bare wafer which is not etched or a wafer which is etched and formed in a crystal grain form; the wafer is a high-transparency wafer, such as a third-generation semiconductor wafer or a transparent wafer; an air inlet is formed in one side of the carrying platform body and is communicated with the cavity; the air inlet mechanism comprises an air inlet pipeline which is connected with the air inlet; the air compression mechanism is connected with the air inlet pipeline and is used for compressing air and inputting the compressed air into the air inlet pipeline; when gas is input into the cavity, the gas overflows from the pluralit</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJANT0xLLVIoLi0uSM0rzszPUyguSUxPVUhJLctMTuVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkaG5oamFoamhqGhxkQpAgAlBiUG</recordid><startdate>20220809</startdate><enddate>20220809</enddate><creator>ZHENG KUNXIAN</creator><scope>EVB</scope></search><sort><creationdate>20220809</creationdate><title>Wafer suspension stage device</title><author>ZHENG KUNXIAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN217158151UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASURING</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHENG KUNXIAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHENG KUNXIAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wafer suspension stage device</title><date>2022-08-09</date><risdate>2022</risdate><abstract>A wafer suspension stage device comprises a stage body, a cavity is formed in the stage body, a plurality of dense air holes are formed in the top surface of the cavity, and the air holes penetrate through the top surface of the cavity and are exposed out of the upper surface of the stage body; the upper part of the carrying table body is used for carrying a wafer, and the wafer is a bare wafer which is not etched or a wafer which is etched and formed in a crystal grain form; the wafer is a high-transparency wafer, such as a third-generation semiconductor wafer or a transparent wafer; an air inlet is formed in one side of the carrying platform body and is communicated with the cavity; the air inlet mechanism comprises an air inlet pipeline which is connected with the air inlet; the air compression mechanism is connected with the air inlet pipeline and is used for compressing air and inputting the compressed air into the air inlet pipeline; when gas is input into the cavity, the gas overflows from the pluralit</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
title Wafer suspension stage device
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