Wafer suspension stage device

A wafer suspension stage device comprises a stage body, a cavity is formed in the stage body, a plurality of dense air holes are formed in the top surface of the cavity, and the air holes penetrate through the top surface of the cavity and are exposed out of the upper surface of the stage body; the...

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1. Verfasser: ZHENG KUNXIAN
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:A wafer suspension stage device comprises a stage body, a cavity is formed in the stage body, a plurality of dense air holes are formed in the top surface of the cavity, and the air holes penetrate through the top surface of the cavity and are exposed out of the upper surface of the stage body; the upper part of the carrying table body is used for carrying a wafer, and the wafer is a bare wafer which is not etched or a wafer which is etched and formed in a crystal grain form; the wafer is a high-transparency wafer, such as a third-generation semiconductor wafer or a transparent wafer; an air inlet is formed in one side of the carrying platform body and is communicated with the cavity; the air inlet mechanism comprises an air inlet pipeline which is connected with the air inlet; the air compression mechanism is connected with the air inlet pipeline and is used for compressing air and inputting the compressed air into the air inlet pipeline; when gas is input into the cavity, the gas overflows from the pluralit