Vacuum magnetron sputtering device with rotating function

The vacuum magnetron sputtering device with the rotating function comprises a shell, dust screens are installed at the bottoms of the two sides of the shell, a power interface is installed in the middle of the bottom of one end of the shell, and a shielding door is rotatably installed at the end, aw...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	WANG HONGFEI, XIONG LANG, LIN MENGTIAN, ZHANG YEFANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The vacuum magnetron sputtering device with the rotating function comprises a shell, dust screens are installed at the bottoms of the two sides of the shell, a power interface is installed in the middle of the bottom of one end of the shell, and a shielding door is rotatably installed at the end, away from the power interface, of the shell through hinges. A control panel is installed in the middle of the end, away from the power interface, of the shielding door, an observation window is installed on the top of the section, away from the power interface, of the shielding door, an exhaust pipe is installed in the middle of the end, close to the shielding door, of the top of the shell, and a gas path pipe is installed in the middle of the end, close to the power interface, of the top of the shell. According to the vacuum magnetron sputtering device, the rotating device is arranged, a worker directly places a plated part on the rotating device, the plated part can rotate in the vacuum magnetron sputtering device