Multi-pressure-head flexible composite leveling mechanism for thin plate
The utility model provides a multi-pressure-head flexible composite flattening mechanism for a thin plate. The multi-pressure-head flexible composite flattening mechanism for the thin plate comprises a base; the first rack and the second rack are arranged on the two opposite sides of the upper surfa...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model provides a multi-pressure-head flexible composite flattening mechanism for a thin plate. The multi-pressure-head flexible composite flattening mechanism for the thin plate comprises a base; the first rack and the second rack are arranged on the two opposite sides of the upper surface of the base. The movable pressing block is arranged on the first rack; the at least one driving device is arranged on the first rack and is used for driving the movable pressing block to move; the first group of adjustable pressure heads are arranged on the movable pressure block; the second group of adjustable pressure heads are arranged on the second rack and right correspond to the first group of adjustable pressure heads, and the distance between the first group of adjustable pressure heads and the second group of adjustable pressure heads is in a complementary state. The leveling effect on the memory thin plate can be achieved, internal stress in the memory thin plate is eliminated, the requirements of diff |
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