Vacuum heating device for low-temperature wafer

The utility model provides a vacuum heating device for a low-temperature wafer, which belongs to the field of semiconductor device manufacturing and comprises a machine body and a heating device, the heating device is connected above the machine body through a support rod, a wafer sucker is fixedly connected above the heating device, an overheating protection device is arranged in the machine body, and the wafer sucker is fixedly connected above the machine body. A supporting rod is fixedly connected above the machine body and fixedly connected with a heating device, a guide pipe is arranged between the machine body and the heating device, a wire is arranged in the guide pipe, and a temperature sensor is arranged in the guide pipe and tightly attached to the lower surface of the heating plate. The combination of the heat conduction plate, the heating plate and the heat insulation plate is adopted, heat waste can be prevented, meanwhile, heat is prevented from being conducted to the machine body through the su