GPF pressure sensor

The utility model relates to the technical field of sensors, in particular to a GPF pressure sensor, which comprises a pressure sensing module and a substrate module, and a cavity groove in which the pressure sensing module can be embedded is arranged on the substrate module. A cavity groove is form...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: QIU XINLONG, XI SHENGHANG, GU CHANGFEI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model relates to the technical field of sensors, in particular to a GPF pressure sensor, which comprises a pressure sensing module and a substrate module, and a cavity groove in which the pressure sensing module can be embedded is arranged on the substrate module. A cavity groove is formed in the substrate module, a second signal electrical connection bonding pad corresponding to the first signal electrical connection bonding pad on the bottom side of the pressure sensing module is arranged in the cavity groove, the pressure sensing module and the substrate module are connected with each other to form a PCBA module, and the PCBA module is packaged through a shell with an air tap. The sensor provided by the scheme is simple in structure and low in process requirement, and the reliability of the sensor can be ensured while the processing cost is reduced. 本实用新型涉及传感器技术领域,具体是一种GPF压力传感器,包括压力感应模块与基板模块,在所述基板模块上开设有可嵌设所述压力感应模块的腔槽,所述腔槽内设置有可与所述压力感应模块底侧第一信号电气连接焊盘对应的第二信号电气连接焊盘,所述压力感应模块与所述基板模块相互连接后构成PCBA模块,所述PCB