Electroplating device for deep plating of printed circuit board

The utility model discloses a deep plating electroplating device for a printed circuit board, which belongs to the technical field of electroplating equipment and comprises an electroplating tank, a support frame arranged at the top of the electroplating tank, a hydraulic cylinder arranged at the top of the support frame, an output end of the hydraulic cylinder penetrating through the top of the support frame and connected with a support plate, and connecting plates symmetrically connected to two sides of the bottom of the support plate. A clamping plate is movably connected to the side wall of one end of the connecting plate through a second hinge, two air cylinders are symmetrically arranged on the surface of the top of the supporting plate, the output ends of the air cylinders penetrate through the supporting plate and are connected with clamping blocks through first hinges, and clamping grooves matched with the first clamping blocks are formed in the surface of the clamping plate. A heat exchanger is arra