Solder ball repairing device

The utility model discloses a solder ball repairing device which is suitable for repairing damaged solder balls on the bottom surfaces of chips, a plurality of chips are placed on a chip disc, the solder ball repairing device comprises a jig disc, a microscopic device, a display device, an air gun d...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LI SHUANGCHENG, MA HAILONG, FAN CHUANMIN, YUAN JUN, LU XUKUN
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The utility model discloses a solder ball repairing device which is suitable for repairing damaged solder balls on the bottom surfaces of chips, a plurality of chips are placed on a chip disc, the solder ball repairing device comprises a jig disc, a microscopic device, a display device, an air gun device and a repairing table, the jig disc is used for covering the chip disc, a plurality of limiting grooves are formed in the jig disc, the limiting grooves correspond to the chips one by one, and the microscopy device is arranged on the jig disc. The limiting grooves are used for receiving chips with upward bottom surfaces after the chip disc is turned over; the microscopic device is used for acquiring a picture of the damaged solder ball, and the display device is used for displaying the picture acquired by the microscopic device in real time; the blower gun device is used for heating the damaged solder balls so as to melt and reshape the damaged solder balls; the repairing table comprises a fixed base and a mo