Packaging structure of optical device

The utility model relates to the technical field of integrated circuit packaging, and discloses a packaging structure of an optical device. The packaging structure of the optical device comprises a substrate, an optical sensing chip borne on the substrate, a light-transmitting body borne on the opti...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	XIE JIANYOU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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