Packaging structure of optical device
The utility model relates to the technical field of integrated circuit packaging, and discloses a packaging structure of an optical device. The packaging structure of the optical device comprises a substrate, an optical sensing chip borne on the substrate, a light-transmitting body borne on the opti...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to the technical field of integrated circuit packaging, and discloses a packaging structure of an optical device. The packaging structure of the optical device comprises a substrate, an optical sensing chip borne on the substrate, a light-transmitting body borne on the optical sensing chip and an LED chip on a non-light-sensing area, the light-transmitting body and the LED chip are separated by a light-proof plastic packaging body, the optical sensing chip, the LED chip and the light-transmitting body are wrapped by the light-proof plastic packaging body, and the light-transmitting body and the light-transmitting body are wrapped by the light-proof plastic packaging body. The light-proof plastic package body is provided with a light-transmitting part, at least part of the light-transmitting part is exposed to the outside, the LED chip can send light to the outside through the light-transmitting part, at least part of the light-transmitting body is exposed to the outside, and the ligh |
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