Flattening machine for semiconductor packaging production

The utility model discloses a flattening machine table for semiconductor packaging production, which comprises a base, a bearing table is fixed at the upper end of the base, a substrate is placed at the upper end of the bearing table, a clamping mechanism for fixing and clamping the substrate is arr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG WEI, LEE SEUNG-HO, KIM EUN-TAEK, YUN JONG-MAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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