Flattening machine for semiconductor packaging production

The utility model discloses a flattening machine table for semiconductor packaging production, which comprises a base, a bearing table is fixed at the upper end of the base, a substrate is placed at the upper end of the bearing table, a clamping mechanism for fixing and clamping the substrate is arranged at the upper end of the bearing table, a jacking mechanism is arranged in the bearing table, and the jacking mechanism is connected with the bearing table. A motor can drive a driving gear to rotate through an output shaft of the motor, and when the driving gear rotates, a first toothed bar and a second toothed bar can be driven to move in opposite directions, so that substrates of different sizes can be clamped and fixed through a first clamping plate and a second clamping plate, a lead screw is rotated through a rotating rod, and when the lead screw rotates, the lead screw can be clamped and fixed through the rotating rod. The moving directions of the two threaded cylinders are opposite, the moving table an