Cloud terminal
The utility model provides a cloud terminal, which comprises a bottom plate, a circuit board, a heat dissipation component, a middle frame and a touch panel, and is characterized in that the circuit board is arranged on one side of the bottom plate; one end of the circuit board comprises a groove wh...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The utility model provides a cloud terminal, which comprises a bottom plate, a circuit board, a heat dissipation component, a middle frame and a touch panel, and is characterized in that the circuit board is arranged on one side of the bottom plate; one end of the circuit board comprises a groove which is recessed inwards from the edge, the heat dissipation part is arranged in the groove, and the heat dissipation part is used for dissipating heat of the circuit board; the touch panel is arranged on one side, back on to the bottom plate, of the circuit board; the middle frame comprises a first end and a second end which are communicated with each other, the first end is connected with the bottom plate, and the second end is connected with the touch panel. And the heat dissipation efficiency of the cloud terminal is improved.
本实用新型提供一种云终端,该云终端包括:底板、电路板、散热部件、中框和触控板,其中,所述电路板设置在所述底板的一侧;所述电路板的一端包括由边缘向内凹陷的凹槽,所述散热部件设置于所述凹槽中,所述散热部件用于对所述电路板散热;所述触控板设置于所述电路板背向所述底板的一侧;所述中框包括贯通的第一端和第二端,所述第一端与所述底板连接,所述第二端与所述触控板连接。提高云终端的散热效率 |
---|