High-power semiconductor device packaging structure

The utility model discloses a high-power semiconductor device packaging structure, one end of which is located at the other end of a right pin at the outer side of an epoxy packaging body, extends into the epoxy packaging body and is connected with a connecting sheet, and one end of which is located...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHEN JIAYONG, LIU YULONG, HE HONGYUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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