Liquid cooling assembly and liquid cooling device
The utility model provides a liquid cooling assembly and a liquid cooling device, and the liquid cooling assembly comprises a heat conduction plate which is used for carrying out the heat dissipation of an attached storage module; and the liquid cooling pipe is arranged at one end of the heat conduc...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model provides a liquid cooling assembly and a liquid cooling device, and the liquid cooling assembly comprises a heat conduction plate which is used for carrying out the heat dissipation of an attached storage module; and the liquid cooling pipe is arranged at one end of the heat conducting plate, is connected with the heat conducting plate through a flexible connector, and is used for carrying out liquid cooling heat dissipation on the heat conducting plate. The heat conduction plate and the liquid cooling pipe are connected through the elastic metal sheet or the soft metal belt, the deformability is achieved under the condition that good heat conduction is guaranteed, the heat conduction plate and the liquid cooling pipe are of an integrated structure, connection is reliable, a heat conduction gasket does not need to be added, and heat conduction resistance of the heat conduction plate in the process of transferring heat to the liquid cooling pipe can be reduced.
本实用新型提供一种液冷组件及液冷装置,所述液冷组件包括:导热板 |
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