Testing equipment for thermal impedance of wafer in IGBT (Insulated Gate Bipolar Translator) module

The utility model discloses an IGBT module internal wafer thermal impedance test device, which comprises a device body, the device body comprises a base, a workbench, a control device, a telescopic device, a support frame, an infrared thermal imager and a groove, the base is arranged at the bottom of the device body, the top of the base is connected with the workbench in a welding mode, and the control device is connected with the telescopic device. The top of the workbench is provided with a telescopic device and a groove, the groove is located in the middle of the top end of the workbench, the telescopic device is located on the left side of the groove, a supporting frame is welded to the top of the telescopic device, and an infrared thermal imager is welded to the bottom of one end of the supporting frame. The device is provided with the telescopic device, the telescopic device can adjust the height of the thermal infrared imager, so that the testing accuracy of the thermal infrared imager is improved, the