Device for positioning carrier plate in CVD (chemical vapor deposition) process cavity
The utility model discloses a device for positioning a support plate in a CVD (chemical vapor deposition) process cavity, which comprises positioning mechanisms, a sensor and a conveying mechanism, the conveying mechanism is used for conveying the support plate to a preset position, the sensor is us...
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| creator | CHEN TECHAO ZENG WUYANG WANG SUIXIN CHEN ZHENYANG LI YUNHUA |
| description | The utility model discloses a device for positioning a support plate in a CVD (chemical vapor deposition) process cavity, which comprises positioning mechanisms, a sensor and a conveying mechanism, the conveying mechanism is used for conveying the support plate to a preset position, the sensor is used for positioning the position of the support plate, the positioning mechanisms are arranged on two sides of the advancing direction of the support plate, and the sensors are arranged on the two sides of the advancing direction of the support plate. And actions are made according to the position information fed back by the sensor, and the vertex of the carrier plate is positioned, so that the carrier plate is limited at a target position. The device for positioning the support plate in the CVD process cavity has the advantages of compact structure, simplicity in operation, high positioning accuracy and the like, realizes rapid and accurate positioning of the support plate, and improves the stability and the unifor |
| format | Patent |
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And actions are made according to the position information fed back by the sensor, and the vertex of the carrier plate is positioned, so that the carrier plate is limited at a target position. The device for positioning the support plate in the CVD process cavity has the advantages of compact structure, simplicity in operation, high positioning accuracy and the like, realizes rapid and accurate positioning of the support plate, and improves the stability and the unifor</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220715&DB=EPODOC&CC=CN&NR=216972675U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220715&DB=EPODOC&CC=CN&NR=216972675U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN TECHAO</creatorcontrib><creatorcontrib>ZENG WUYANG</creatorcontrib><creatorcontrib>WANG SUIXIN</creatorcontrib><creatorcontrib>CHEN ZHENYANG</creatorcontrib><creatorcontrib>LI YUNHUA</creatorcontrib><title>Device for positioning carrier plate in CVD (chemical vapor deposition) process cavity</title><description>The utility model discloses a device for positioning a support plate in a CVD (chemical vapor deposition) process cavity, which comprises positioning mechanisms, a sensor and a conveying mechanism, the conveying mechanism is used for conveying the support plate to a preset position, the sensor is used for positioning the position of the support plate, the positioning mechanisms are arranged on two sides of the advancing direction of the support plate, and the sensors are arranged on the two sides of the advancing direction of the support plate. And actions are made according to the position information fed back by the sensor, and the vertex of the carrier plate is positioned, so that the carrier plate is limited at a target position. The device for positioning the support plate in the CVD process cavity has the advantages of compact structure, simplicity in operation, high positioning accuracy and the like, realizes rapid and accurate positioning of the support plate, and improves the stability and the unifor</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAhzSS3LTE5VSMsvUijIL84syczPy8xLV0hOLCrKTAWK5SSWpCpk5ik4h7koaCRnpOZmJifmKJQlFgA1pKTCtGgqFBTlJ6cWFwM1lmWWVPIwsKYl5hSn8kJpbgYlN9cQZw9doI741OKCxOTUvNSSeGc_I0MzS3MjM3PT0FBjohQBAFJ9OgM</recordid><startdate>20220715</startdate><enddate>20220715</enddate><creator>CHEN TECHAO</creator><creator>ZENG WUYANG</creator><creator>WANG SUIXIN</creator><creator>CHEN ZHENYANG</creator><creator>LI YUNHUA</creator><scope>EVB</scope></search><sort><creationdate>20220715</creationdate><title>Device for positioning carrier plate in CVD (chemical vapor deposition) process cavity</title><author>CHEN TECHAO ; ZENG WUYANG ; WANG SUIXIN ; CHEN ZHENYANG ; LI YUNHUA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN216972675UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>CHEN TECHAO</creatorcontrib><creatorcontrib>ZENG WUYANG</creatorcontrib><creatorcontrib>WANG SUIXIN</creatorcontrib><creatorcontrib>CHEN ZHENYANG</creatorcontrib><creatorcontrib>LI YUNHUA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHEN TECHAO</au><au>ZENG WUYANG</au><au>WANG SUIXIN</au><au>CHEN ZHENYANG</au><au>LI YUNHUA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Device for positioning carrier plate in CVD (chemical vapor deposition) process cavity</title><date>2022-07-15</date><risdate>2022</risdate><abstract>The utility model discloses a device for positioning a support plate in a CVD (chemical vapor deposition) process cavity, which comprises positioning mechanisms, a sensor and a conveying mechanism, the conveying mechanism is used for conveying the support plate to a preset position, the sensor is used for positioning the position of the support plate, the positioning mechanisms are arranged on two sides of the advancing direction of the support plate, and the sensors are arranged on the two sides of the advancing direction of the support plate. And actions are made according to the position information fed back by the sensor, and the vertex of the carrier plate is positioned, so that the carrier plate is limited at a target position. The device for positioning the support plate in the CVD process cavity has the advantages of compact structure, simplicity in operation, high positioning accuracy and the like, realizes rapid and accurate positioning of the support plate, and improves the stability and the unifor</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Device for positioning carrier plate in CVD (chemical vapor deposition) process cavity |
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