Floating type heat dissipation device

The utility model discloses a floating type heat dissipation device which comprises a carrier plate supported by at least one heat dissipation base, a through groove matched with the top end of the heat dissipation base in shape is formed in the carrier plate, the heat dissipation base is connected with the carrier plate through a spring assembly, in the normal state, the top end of the heat dissipation base is hidden below the through groove, and when the carrier plate is pressed down due to external force, the through groove is closed. The top end of the heat dissipation base can penetrate through the through groove. According to the utility model, the design is reasonable, the use is convenient, when the to-be-tested board is placed on the carrier board, the to-be-cooled chip and other devices of the to-be-tested board are pressed on the heat dissipation seat, the heat dissipation can be carried out aiming at products in different height ranges and different installation heights of the same product, the ef