Soldering flux dipping device

The utility model provides a scaling powder dipping device which comprises a first platform and a second platform, the first platform is provided with a containing groove, scaling powder is injected into the containing groove, the second platform is located above the first platform, the second platform comprises a main body, the main body is opposite to the first platform, and a chip is located on the side, facing the first platform, of the main body. And the main body can move relative to the first platform, so that the chip can be dipped in the soldering flux in the accommodating groove, the chip can be dipped in a proper amount of soldering flux, the large-size edge is prevented from deviating in the printing process, the accuracy is ensured, and meanwhile, the waste of the soldering flux is avoided. 本实用新型提供一种助焊剂蘸取装置，包括第一平台和第二平台，第一平台具有容置槽，容置槽内注入有助焊剂，第二平台位于第一平台的上方，第二平台包括主体，主体与第一平台相对，芯片位于主体朝向第一平台的一侧，且主体可相对于第一平台移动，以使芯片可以蘸取容置槽内的助焊剂，从而可以保证芯片蘸取适量助焊剂，避免便于印制过程时大尺寸的边缘产生偏移，保证精确性，同时避免助焊剂浪费。