Micropore electroplating device

The micropore electroplating device comprises a box body, a top cover, a bottom cover and an electromagnetic reversing valve, a hydraulic cylinder is fixed in the middle of the top end in the box body, the output end of the hydraulic cylinder is fixedly connected with a top frame, the top cover is f...

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Bibliographische Detailangaben
Hauptverfasser:	LUO XIAOBING, CHEN QIUDUO, CHEN DENING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	The micropore electroplating device comprises a box body, a top cover, a bottom cover and an electromagnetic reversing valve, a hydraulic cylinder is fixed in the middle of the top end in the box body, the output end of the hydraulic cylinder is fixedly connected with a top frame, the top cover is fixed in the top frame, the bottom cover is arranged at the bottom end of the top cover, and the bottom cover is fixed in the bottom frame. The bottom frame is fixed to the bottom end in the box body, a pump body is fixed to one side in the box body, the output end of the pump body is connected with a top cover through a second pipeline, the input end of the pump body is connected with an electromagnetic reversing valve, and one side of the electromagnetic reversing valve is connected with a bottom cover through a first pipeline. The other side of the electromagnetic reversing valve is connected with the liquid tank through a third pipeline, and a leakage opening is formed in the top end of the middle of the liquid