Package structure

A packaging structure comprises a lead frame, a semiconductor chip and a plastic packaging material. The lead frame comprises a chip seat and a plurality of pins. The pins are arranged on the periphery of the chip seat, and each pin comprises a body, at least one extension part and a plurality of electroplating surfaces. The extension part is connected with the body, and the body and the extension part are integrally formed. The electroplating surface is arranged on the body and the extension part. The semiconductor chip is arranged on the chip seat of the lead frame. The plastic packaging material is arranged on the lead frame. The body and the extension part of each pin protrude out of the outer edge of the plastic packaging material. Therefore, the welding strength of the packaging structure and the circuit board can be improved. 一种封装结构，其包含一导线架、一半导体芯片及一塑胶封装材料。导线架包含一芯片座与多个引脚。引脚设置于芯片座的四周，且各引脚包含一本体、至少一延伸部及多个电镀面。延伸部连接本体，且本体与延伸部为一体成型。电镀面设置于本体与延伸部。半导体芯片设置于导线架的芯片座上。塑胶封装材料设置于导线架上。各引脚的本体与延伸部突出于塑胶封装材料的外缘。借此，可提升封装结构与