Polishing pad trimmer and chemical mechanical polishing device

The utility model relates to the technical field of semiconductor manufacturing, in particular to a polishing pad trimmer and a chemical mechanical polishing device. The grinding pad trimmer comprises a trimming assembly and a grinding pad, the trimming assembly comprises a plurality of independent trimming discs, each trimming disc comprises trimming particles, and the particle sizes of the trimming particles in the multiple trimming discs are different from one another; and the control assembly is connected with the multiple finishing discs and used for controlling each finishing disc to do telescopic motion in the axis direction of the finishing disc, so that each finishing disc can independently finish the grinding pad. The service life of the grinding pad trimmer is prolonged. 本实用新型涉及半导体制造技术领域，尤其涉及一种研磨垫修整器及化学机械研磨装置。所述研磨垫修整器包括：修整组件，包括多个相互独立的修整盘，每个所述修整盘中均包括修整颗粒，且多个所述修整盘中的所述修整颗粒的粒径互不相同；控制组件，与多个所述修整盘连接，用于分别控制每一个所述修整盘沿其自身的轴线方向伸缩运动，使得每个所述修整盘能够单独修整研磨垫。本实用新型延长了所述研磨垫修整器的使用寿命。