Wafer boat structure for forming film in semiconductor smelting furnace equipment

The utility model relates to the technical field of semiconductor manufacturing, and discloses a wafer boat structure for forming a film in semiconductor smelting furnace equipment, which comprises a support piece for placing a wafer and a blocking piece, the support piece is arc-shaped or ring-shap...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: AHN JUNG-IL, LEE DONG-KEUN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model relates to the technical field of semiconductor manufacturing, and discloses a wafer boat structure for forming a film in semiconductor smelting furnace equipment, which comprises a support piece for placing a wafer and a blocking piece, the support piece is arc-shaped or ring-shaped, the blocking piece is arranged on the outer edge of the support piece, and the blocking piece is arranged on the outer edge of the support piece. The upper surface of the blocking piece is higher than the upper surface of the supporting piece. According to the utility model, the defects of yield reduction and the like caused by non-uniform wafer edge thickness data in the prior art are overcome. 本实用新型涉及半导体制造技术领域,公开了一种半导体熔炉设备中用于形成膜质的晶舟结构,包括用于放置晶圆的支撑件、阻挡件,所述支撑件的形状为圆弧状或环状,所述阻挡件设于所述支撑件的外边缘,所述阻挡件的上表面高于所述支撑件的上表面。本实用新型解决了现有技术存在的晶圆边缘厚度数据不均匀导致的良率下降等不足。