Modularized data center intelligent heat dissipation device
The utility model discloses an intelligent heat dissipation device for a modularized data center. The intelligent heat dissipation device comprises a cabinet, a vertical plate, a mounting plate, a first connecting plate, a second connecting plate, a hollow plate, a connecting rod, a cold air pipe, a...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses an intelligent heat dissipation device for a modularized data center. The intelligent heat dissipation device comprises a cabinet, a vertical plate, a mounting plate, a first connecting plate, a second connecting plate, a hollow plate, a connecting rod, a cold air pipe, a first through pipe, a fitting plate, a connecting pipe, a pipeline fan, a second through pipe, an embedded plate, a filter screen and a filter bag. Through the arrangement of a heat dissipation mechanism and under the action of a first through pipe, cold air continuously enters a cavity of a first connecting plate, the cold air is exhausted through an air outlet hole in the bottom of the first connecting plate, and then air above the equipment is cooled; and air below the equipment continuously enters the cavity of the second connecting plate and then is discharged out of the cabinet through the connecting pipe, so that heat dissipation and cooling of the equipment are completed.
本实用新型公开了一种模块化数据中心智能散热装置,包括机柜、竖板、安装 |
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