COB packaging all-in-one module

The utility model discloses a COB packaging all-in-one module. The COB packaging all-in-one module comprises a PCB and a plurality of control units. The plurality of control units are arranged on the surface of the PCB, each control unit is adhered to the surface of the PCB through a conductive adhe...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ZHU WEIPING, ZHOU GUOHUA, HONG RONGHUI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The utility model discloses a COB packaging all-in-one module. The COB packaging all-in-one module comprises a PCB and a plurality of control units. The plurality of control units are arranged on the surface of the PCB, each control unit is adhered to the surface of the PCB through a conductive adhesive and is in conduction connection with the PCB through lead bonding, the plurality of control units are covered and packaged by a packaging adhesive, each control unit comprises an IC (integrated circuit) and a plurality of pixel points, each pixel point is in conduction connection with the IC, and the plurality of control units are arranged on the surface of the PCB. And each pixel point is composed of a red light wafer, a green light wafer and a blue light wafer. Each control unit is adhered to the surface of the PCB through the conductive adhesive and is in conduction connection with the PCB through lead bonding, and the IC and the plurality of pixel points are attached to the surface of the PCB, so that the