Packaging equipment

The utility model provides a packaging device used for packaging a chip on a substrate, the packaging device comprises a first die and a second die, the first die is provided with an adsorption hole, the adsorption hole is communicated with the bottom of the first die, the first die is configured to adsorb the substrate to the bottom of the first die through the adsorption hole, and the second die is configured to adsorb the substrate to the bottom of the first die through the adsorption hole. The second mold is located below the first mold, a packaging groove is formed in the side, facing the first mold, of the second mold, and packaging colloid is arranged in the packaging groove; the first mold can move relative to the second mold, and the chip is located on the side, facing the second mold, of the substrate, so that when the first mold and the second mold are pressed, the packaging colloid packages the chip, the flat state of the substrate can be kept, the warping problem of the substrate is solved, and m