Chip packaging structure

The utility model discloses a chip packaging structure. The chip packaging structure comprises a chip supporting structure and at least two functional chips, the insulating medium through hole layer is located between the chip supporting structure and the functional chip, the insulating medium through hole layer comprises an insulating medium layer and at least one first conductive through hole, and the first conductive through hole is used for achieving transmission of electric signals between the chip supporting structure and the functional chip; the silicon bridge chip is located between the chip supporting structure and the functional chips, a first bonding pad is arranged on the surface, away from the chip supporting structure, of the silicon bridge chip, a connecting chip electrically connected with the first bonding pad is arranged in the silicon bridge chip, and the first bonding pad is used for achieving transmission of electric signals between the functional chips; the orthographic projection of the