Connecting mechanism and microwave plasma chemical vapor deposition equipment
The utility model relates to a connecting mechanism and microwave plasma chemical vapor deposition equipment comprising the same. According to the technical scheme, the connecting mechanism comprises an upper flange and a lower flange, and is characterized in that the flanges are provided with choke...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The utility model relates to a connecting mechanism and microwave plasma chemical vapor deposition equipment comprising the same. According to the technical scheme, the connecting mechanism comprises an upper flange and a lower flange, and is characterized in that the flanges are provided with choke grooves, a wave guide medium is arranged between the upper flange and the lower flange, an upper cavity and a lower cavity are isolated by the wave guide medium, and the wave guide medium is embedded in the choke grooves; the choke groove comprises a transverse groove section and a longitudinal groove section which are communicated with each other, the depths of the two groove sections are the same and are odd times of those of the two groove sections, lambda is the wavelength of microwaves conducted in the upper cavity and the lower cavity, and epsilon is the dielectric constant of the wave guide medium. According to the utility model, the choke groove is arranged on the connecting flange, so that the sealing per |
---|