Semi-intrusive brain-computer interface module realized by using plastic package grinding process

The utility model relates to the technical field of brain-computer interfaces, and discloses a semi-intrusive brain-computer interface module realized by using a plastic package grinding process, which comprises a circuit board, a control chip and an electrode chip. The circuit board is configured to be connectable to an external device. The bottom surface of the control chip is fixedly connected with the circuit board, and the top surface of the control chip is welded with the flip chip. A first bonding pad is arranged on the top face of the control chip in the circumferential direction, and the first bonding pad is electrically connected with the circuit board through a lead. An electrode is arranged at one end of the electrode chip, is in a rigid needle shape and is used for being connected with brain neurons. Compared with a flexible wire electrode, the outer layer of the rigid needle-shaped electrode does not need to be wrapped with an insulating sheath, so that more electrodes can be accommodated in uni