Smart phone with external heat dissipation structure

The utility model discloses a smart phone with an external heat dissipation structure, which comprises a phone body, one side of the phone body is provided with a back groove, the back groove is provided with a sealing plate, the back groove is internally provided with a liquid bin, and the liquid bin is connected with a control module; the button is installed on the control module, and a micro booster pump is arranged on the side edge of the control module; and the flow guide pipe is located at the end, away from the micro booster pump, of the pipeline connecting mechanism, cooling fins are arranged on the side edge of the pipeline connecting mechanism, and a conduction circuit is connected to the pipeline connecting mechanism. Through the sealing plate clamped with the back groove, parts in the back groove can be overhauled and cleaned when the sealing plate is disassembled, and meanwhile, the sealing plate can realize protection treatment of the whole device, so that the use convenience of the device is en