Anode device for wafer electroplating

The utility model discloses an anode device for wafer electroplating, which comprises an electroplating tank, a distributor is fixedly connected in the electroplating tank, an air inlet of the distributor is respectively communicated with a liquid adding pipe and a liquid return pipe, the liquid add...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HUANG JIN, XIE XINWEI, ZENG XIANLAN, ZHANG QIFEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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