Anode device for wafer electroplating

The utility model discloses an anode device for wafer electroplating, which comprises an electroplating tank, a distributor is fixedly connected in the electroplating tank, an air inlet of the distributor is respectively communicated with a liquid adding pipe and a liquid return pipe, the liquid adding pipe is arranged on the left side of a water pump a, the water pump a is communicated with a filter a, the filter a is communicated with an electroplating liquid box, and the electroplating liquid box is arranged on the left side of the electroplating tank. An electric push rod is installed on the right side of the electroplating pool, a supporting frame is fixedly connected to the top end of the electric push rod, a positioning frame is fixedly connected to the bottom end of the supporting frame, a rotating frame is rotationally connected into the positioning frame, a brush is connected to the surface of the rotating frame in an embedded mode, an ultrasonic vibrator is installed in the middle of the rotating f