Circuit board welding structure and packaging structure, shielding structure and shielding substrate thereof

The utility model discloses a circuit board welding structure and a packaging structure, a shielding structure and a shielding substrate thereof, the shielding substrate is used for welding components, the components comprise a to-be-shielded device, the shielding substrate comprises a substrate mai...

Ausführliche Beschreibung

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Hauptverfasser: WANG LINA, ZHENG LINGHUI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model discloses a circuit board welding structure and a packaging structure, a shielding structure and a shielding substrate thereof, the shielding substrate is used for welding components, the components comprise a to-be-shielded device, the shielding substrate comprises a substrate main body, one side of the substrate main body is provided with an accommodating groove along a direction towards the other side of the substrate main body; the shielding cover covers the opening of the accommodating groove, and an installation cavity is formed by the shielding cover and the inner wall of the accommodating groove and used for accommodating a to-be-shielded device; the insulating layer is arranged on the side, away from the bottom wall of the containing groove, of the shielding cover. According to the invention, the accommodating groove is formed in the substrate main body and forms the mounting cavity with a shielding effect with the mounting cover, so that the to-be-shielded device can be accommodate