Packaging substrate and circuit board

The utility model discloses a packaging substrate and a circuit board, the packaging substrate comprises a circuit substrate, bonding pads are formed on the surface of at least one side of the circuit substrate, the bonding pads comprise a bottom bonding pad and edge bonding pads, the edge bonding p...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	YU GONGCHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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