Packaging substrate and circuit board

The utility model discloses a packaging substrate and a circuit board, the packaging substrate comprises a circuit substrate, bonding pads are formed on the surface of at least one side of the circuit substrate, the bonding pads comprise a bottom bonding pad and edge bonding pads, the edge bonding pads and the bottom bonding pad are arranged at intervals, and the edge bonding pads are dispersedly arranged on the periphery of the bottom bonding pad. And the circuit substrate is provided with a solder resist window at the periphery of the bottom bonding pad. Through the above structure, the cleaning channel is added, and the reliability of pad welding is improved. 本申请公开了一种封装基板及电路板，其中，封装基板包括线路基板，线路基板的至少一侧表面上形成有焊盘，焊盘包括底部焊盘与边缘焊盘，边缘焊盘有多个，与底部焊盘间隔设置，且分散设置于底部焊盘的周边，线路基板在底部焊盘的周边形成有阻焊开窗。通过上述结构，增加清洗通道，提高焊盘焊接的可靠性。