High-efficiency heat-seal leveling device for circuit board
The utility model relates to the technical field of circuit board devices, and discloses an efficient heat-sealing leveling device for a circuit board, the efficient heat-sealing leveling device comprises a base, a heat-sealing assembly, a positioning assembly, a leveling assembly and four vertical...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to the technical field of circuit board devices, and discloses an efficient heat-sealing leveling device for a circuit board, the efficient heat-sealing leveling device comprises a base, a heat-sealing assembly, a positioning assembly, a leveling assembly and four vertical blocks, the base is horizontally arranged, the four vertical blocks are arranged at the top of the base in a rectangular shape, the heat-sealing assembly is arranged among the four vertical blocks, and the positioning assembly is arranged between the four vertical blocks. The leveling assembly is also arranged among the four vertical blocks and located below the heat sealing assembly, the positioning assembly is arranged in the base, and the top of the positioning assembly penetrates through the base and extends upwards. The circuit board heat sealing device has the advantages that the circuit board can be clamped and positioned through the positioning assembly, practicability is improved, meanwhile, heat sealing w |
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