Semiconductor intelligent storage material taking mechanism

The utility model relates to the technical field of intelligent storage, in particular to a semiconductor intelligent storage material taking mechanism which comprises a material taking plate and a telescopic mechanism, and the telescopic mechanism is used for controlling the material taking plate to move front and back. And the material pressing mechanism is used for fixing the material disc. According to the semiconductor intelligent storage material taking mechanism, after the material taking plate lifts the material disc, the material disc is shrunk to the position below the upper pressing plate, so that the material taking length of the clamping jaw is controlled, material taking is conveniently conducted on the material discs at the storage positions of different depths, meanwhile, the conveying radius of the shrunk clamping jaw can be reduced, and the conveying efficiency is improved. The material taking disc can be conveniently operated in a narrow space, the situation that clamping jaws interfere wit