Floor heat insulation pad based on multi-layer structure
The utility model discloses a floor heat insulation pad based on a multilayer structure, which comprises a heat insulation pad body, the heat insulation pad body comprises aluminum foil layers, phenolic aldehyde thermosetting felt and sound insulation cotton, the phenolic aldehyde thermosetting felt...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a floor heat insulation pad based on a multilayer structure, which comprises a heat insulation pad body, the heat insulation pad body comprises aluminum foil layers, phenolic aldehyde thermosetting felt and sound insulation cotton, the phenolic aldehyde thermosetting felt is attached to the sound insulation cotton, and the aluminum foil layers are respectively positioned on the upper surface of the phenolic aldehyde thermosetting felt and the lower surface of the sound insulation cotton. A plurality of clamping protrusions are evenly distributed on the side, close to the phenolic aldehyde thermosetting felt, of the sound insulation cotton, clamping grooves corresponding to the clamping protrusions in number are formed in the positions, corresponding to the clamping protrusions, of the phenolic aldehyde thermosetting felt, and honeycomb holes are evenly distributed in the side wall of the sound insulation cotton. The phenolic aldehyde thermosetting felt, the aluminum foil layer and |
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