Target material backboard structure for semiconductor wafer manufacturing

The utility model discloses a semiconductor wafer manufacturing target material back plate structure, relates to the related field of semiconductor wafers, and aims to solve the problem that a target material back plate and a target material cannot be quickly connected in the prior art. A first bottom cover plate is arranged at the lower end of the first back plate, the first bottom cover plate is in a semicircular plate shape, the first bottom cover plate is attached to the first back plate, a second back plate is arranged on one side of the first back plate, and the second back plate and the first back plate are consistent in shape and size. A first bottom cover plate is arranged at the lower end of the first back plate, a second bottom cover plate is arranged at the lower end of the second back plate, the second bottom cover plate and the first bottom cover plate are consistent in shape and size, mounting holes are formed in the first back plate and the second back plate, the mounting holes are in a circul