Multi-layer high-density double-sided PCB (Printed Circuit Board) preparation device
The utility model relates to a multi-layer high-density double-sided PCB (printed circuit board) preparation device, which comprises a support plate, one side of the top of the support plate is provided with a placement mechanism for limiting and placing a PCB, and the other side of the top of the s...
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creator | KIM SAE-YONG |
description | The utility model relates to a multi-layer high-density double-sided PCB (printed circuit board) preparation device, which comprises a support plate, one side of the top of the support plate is provided with a placement mechanism for limiting and placing a PCB, and the other side of the top of the support plate is provided with a cleaning mechanism for cleaning scraps on the top surface of the PCB. A mounting frame is fixedly mounted below the supporting plate, a recycling mechanism used for recycling scraps is arranged at the top of the mounting frame, a first sliding block is matched with the groove wall of a mounting groove to limit a PCB, an external punching device can conveniently punch the PCB, a second electric push rod stretches out and draws back, the punched PCB can be conveniently cleaned by a cleaning brush, and the punching efficiency of the PCB is improved. The air suction pipe is matched with a plurality of air holes, the chippings are sucked into the recycling box, the influence of the chippi |
format | Patent |
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A mounting frame is fixedly mounted below the supporting plate, a recycling mechanism used for recycling scraps is arranged at the top of the mounting frame, a first sliding block is matched with the groove wall of a mounting groove to limit a PCB, an external punching device can conveniently punch the PCB, a second electric push rod stretches out and draws back, the punched PCB can be conveniently cleaned by a cleaning brush, and the punching efficiency of the PCB is improved. The air suction pipe is matched with a plurality of air holes, the chippings are sucked into the recycling box, the influence of the chippi</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CUTTING ; CUTTING-OUT ; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HAND CUTTING TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORATING ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; PUNCHING ; SEVERING ; SEVERING BY MEANS OTHER THAN CUTTING ; STAMPING-OUT ; TRANSPORTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220405&DB=EPODOC&CC=CN&NR=216180967U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220405&DB=EPODOC&CC=CN&NR=216180967U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM SAE-YONG</creatorcontrib><title>Multi-layer high-density double-sided PCB (Printed Circuit Board) preparation device</title><description>The utility model relates to a multi-layer high-density double-sided PCB (printed circuit board) preparation device, which comprises a support plate, one side of the top of the support plate is provided with a placement mechanism for limiting and placing a PCB, and the other side of the top of the support plate is provided with a cleaning mechanism for cleaning scraps on the top surface of the PCB. A mounting frame is fixedly mounted below the supporting plate, a recycling mechanism used for recycling scraps is arranged at the top of the mounting frame, a first sliding block is matched with the groove wall of a mounting groove to limit a PCB, an external punching device can conveniently punch the PCB, a second electric push rod stretches out and draws back, the punched PCB can be conveniently cleaned by a cleaning brush, and the punching efficiency of the PCB is improved. 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A mounting frame is fixedly mounted below the supporting plate, a recycling mechanism used for recycling scraps is arranged at the top of the mounting frame, a first sliding block is matched with the groove wall of a mounting groove to limit a PCB, an external punching device can conveniently punch the PCB, a second electric push rod stretches out and draws back, the punched PCB can be conveniently cleaned by a cleaning brush, and the punching efficiency of the PCB is improved. The air suction pipe is matched with a plurality of air holes, the chippings are sucked into the recycling box, the influence of the chippi</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
recordid | cdi_epo_espacenet_CN216180967UU |
source | esp@cenet |
subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CUTTING CUTTING-OUT DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND CUTTING TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORATING PERFORMING OPERATIONS PRINTED CIRCUITS PUNCHING SEVERING SEVERING BY MEANS OTHER THAN CUTTING STAMPING-OUT TRANSPORTING |
title | Multi-layer high-density double-sided PCB (Printed Circuit Board) preparation device |
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