Multi-layer high-density double-sided PCB (Printed Circuit Board) preparation device
The utility model relates to a multi-layer high-density double-sided PCB (printed circuit board) preparation device, which comprises a support plate, one side of the top of the support plate is provided with a placement mechanism for limiting and placing a PCB, and the other side of the top of the s...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to a multi-layer high-density double-sided PCB (printed circuit board) preparation device, which comprises a support plate, one side of the top of the support plate is provided with a placement mechanism for limiting and placing a PCB, and the other side of the top of the support plate is provided with a cleaning mechanism for cleaning scraps on the top surface of the PCB. A mounting frame is fixedly mounted below the supporting plate, a recycling mechanism used for recycling scraps is arranged at the top of the mounting frame, a first sliding block is matched with the groove wall of a mounting groove to limit a PCB, an external punching device can conveniently punch the PCB, a second electric push rod stretches out and draws back, the punched PCB can be conveniently cleaned by a cleaning brush, and the punching efficiency of the PCB is improved. The air suction pipe is matched with a plurality of air holes, the chippings are sucked into the recycling box, the influence of the chippi |
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