Arc wall grinding device

An arc wall grinding device comprises an adjusting mechanism, the adjusting mechanism is provided with a pair of clamping mechanisms, grinding mechanisms are arranged on the two sides of the adjusting mechanism, the adjusting mechanism is used for adjusting the distance between the clamping mechanisms, and the clamping mechanisms are used for clamping a wafer disc and driving the wafer disc to rotate so that the grinding mechanisms can grind the arc wall of the wafer disc. When the wafer disc is processed, the outer wall of the wafer disc can be conveniently polished, the clamping stability of the wafer disc can be ensured when the arc wall of the wafer disc is polished, meanwhile, the rotating stability of the wafer disc can be ensured when the wafer disc is driven to rotate, the polishing quality of the wafer disc is remarkably improved, and the wafer disc polishing device has high practicability. 一种弧壁研磨装置，包括调节机构，调节机构设有一对夹持机构，调节机构的两侧均设有研磨机构，调节机构用于调节夹持机构之间的间距，夹持机构用于晶圆盘的夹持，并带动晶圆盘进行转动，以使研磨机构对晶圆盘的弧壁进行打磨，本实用新型在进