Device for removing metal cover plate of BGA (Ball Grid Array) packaged semiconductor device

The utility model relates to a device for removing a metal cover plate of a BGA (Ball Grid Array) packaging semiconductor device, which comprises a barrel body, a middle column rod, a rotating assembly and a cutter, and is characterized in that ear caps are symmetrically arranged on two sides of the upper part of the barrel body, screw rods are symmetrically arranged on two sides of the lower part of the barrel body, and the middle column rod comprises a buckle, a toothed rod and a polished rod which are connected into a whole from top to bottom; the middle column rod is inserted into the cylinder body, the symmetrically-arranged rotating assemblies comprise gears and handles, the gears are fixed to the ends of the handles, the gears are hinged to the ear caps and matched with the toothed bars, the cutters are L-shaped, the screws are sleeved with the cutters through installation holes and are matched with the screws through first nuts and second nuts for positioning, and the cutter edges of the cutters are o