Crystal slicing device for monocrystalline silicon wafer

The utility model relates to the technical field of slicing device production, in particular to a crystal slicing device for monocrystalline silicon wafers, which comprises a main body and a working motor, a bottom plate seat is arranged on the outer surface of the bottom end of the main body, a mounting seat is fixedly mounted on the outer surface of the upper end of the bottom plate seat, and a fastening mechanism is arranged at the upper end of the mounting seat. An inserting mechanism is arranged on one side of the fastening mechanism, an adjusting mechanism is arranged above the fastening mechanism, a meshing gear is meshed with the outer surface of the adjusting mechanism, and a cutting blade is fixedly connected with the outer surface of the bottom end of the meshing gear. According to the utility model, through the arrangement of the rotating roller, the crystal silicon rod, the supporting wheel and the inserting mechanism, after the crystal silicon rod is placed, the connecting plate is controlled to