Novel high multilayer circuit board pressing positioning tool

The utility model discloses a novel high multilayer circuit board pressing positioning tool comprising pins and at least two auxiliary plates, the auxiliary plates are rectangular, the length and the width of the auxiliary plates are 0.5-2.5 inches longer than a circuit board to be pressed, the thickness of the auxiliary plates is 2-5mm, the auxiliary plates are provided with at least eight pin holes corresponding to the pins, and the pins are inserted into the pin holes. All the pin holes are asymmetrically distributed on the auxiliary plate to play a fool-proof role, at least two pin holes are formed in the position, close to each edge, of the auxiliary plate, and the length of each pin is 0.5-1.5 mm smaller than the sum of the thickness of the auxiliary plate and the thickness of the circuit board to be pressed. According to the utility model, the problem that the layer deviation risk is easy to occur in the lamination process of the existing high multilayer circuit board with small hole-to-wire size is so