Easily packaged silicon optical chip coupling structure and silicon-based wafer

The utility model provides a silicon optical chip coupling structure easy to package and a silicon-based wafer, a plurality of silicon optical chips with the coupling structure are arranged on the silicon-based wafer, each silicon optical chip comprises a functional area and a coupling area arranged...

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Bibliographische Detailangaben
Hauptverfasser: SUN XU, LIN TIANYING, LI CAO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model provides a silicon optical chip coupling structure easy to package and a silicon-based wafer, a plurality of silicon optical chips with the coupling structure are arranged on the silicon-based wafer, each silicon optical chip comprises a functional area and a coupling area arranged on the periphery of the functional area, and a silicon optical waveguide is arranged on the functional area. The coupling area is provided with at least one functional element notch groove used for placing a functional element, the coupling area between the silicon optical waveguide and the functional element notch groove is provided with a lens array notch groove or a lens notch groove, a silicon lens array is arranged in the lens array notch groove, and a silicon lens is arranged in the lens notch groove. And the coupling of the silicon optical waveguide and the functional element is realized through the silicon lens or the silicon lens array. The coupling structure is applied to coupling between a silicon optic