Cooled electrical device assembly
A cooled electrical device assembly comprising an enclosure (2) having a cooling channel (4), a plurality of semiconductor modules, and a cooler comprising a body portion (92) and a plurality of cooling fins (94) protruding from the body portion (92) and forming a plurality of fin channels therebetw...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A cooled electrical device assembly comprising an enclosure (2) having a cooling channel (4), a plurality of semiconductor modules, and a cooler comprising a body portion (92) and a plurality of cooling fins (94) protruding from the body portion (92) and forming a plurality of fin channels therebetween wherein the cooling channel (4) comprises a plurality of parallel cooling channel sections, the utility model relates to a cooled electrical device assembly comprising a plurality of parallel cooling channel sections (901, 902, 903), each of which is adapted to direct parallel sub-streams of cooling air through each cooling channel section, and comprising a plurality of blowers (901, 902, 903) of cooling air, each cooling air blower of the plurality of cooling air blowers is adapted to generate a cooling air flow to one cooling channel section.
一种冷却式电气装置组件,其包括具有冷却通道(4)的围封件(2)、多个半导体模块和冷却器,该冷却器包括本体部分(92)和多个冷却翅片(94),所述多个冷却翅片从本体部分(92)突出并在其间形成多个翅片通道,其中,冷却通道(4)包括多个平行的冷却通道区段,所述多个平行的冷却通道区段中的每个冷却通道区段适于引导冷却空气的平行的子流穿过每个冷却 |
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