Efficient heat dissipation structure of printed circuit board

The utility model discloses a printed circuit board high-efficiency heat radiation structure, which comprises a circuit board, a plurality of through holes are arranged in the circuit board, and the inner side walls of the through holes are fixedly connected with heat conduction rings; the four corners of the back face of the circuit board are fixedly connected with protruding blocks, and the other ends of the protruding blocks are fixedly connected with anti-skid heads. According to the utility model, the bumps and the anti-skid heads are arranged, the bumps and the anti-skid heads at the four corners of the back surface of the circuit board are firstly supported on the bottom plate for mounting the circuit board by mounting the circuit board, so that a certain gap is formed between the circuit board and the mounting bottom plate, the effective heat dissipation effect is facilitated, and the pressure of the circuit board can be buffered through the silica gel material adopted by the anti-skid heads; if the c